Back in March at MWC, Qualcomm first acknowledged the Snapdragon 820 chipset, but then, they only gave out couple of in-explicit hints about would be inside. We’re now very near to the unveiling of the full specs regarding Qualcomm’s next high-end SoC.
This is said to be happening next week at a special event in Los Angeles, on August 11. So far we’ve know from previous reports that the Snapdragon 820 will use custom designed Kryo cores, by Qualcomm. The custom designed Krait CPU cores have been featured in its top of the line offerings as recently as the Snapdragon 805.
The Snapdragon 810 is different in that it uses ARM’s big.LITTLE architecture. The 810 has notably reported for its overheating issues (which are obviously been shot down by Qualcomm on several occasions), so now the device makers everywhere are eagerly waiting for the 820. This chip-set will probably power our smartphones by the end of the year, or, more likely, in early 2016.
It will have the Adreno 530 GPU, a quad-core CPU along with the MDM9x55 LTE Cat.10 modem, and will be made on a FinFET process – either Samsung’s 14nm or TSMC’s 16nm.