The LeEco Le 2S smartphone has been in the rumors since the third quarter of 2016. Its arrival and its dual-SIM variant seem imminent as both the devices have received certification from TENAA, a regulatory body from China. Speculations suggest that the both the smartphones will be unveiled at Mobile World Congress (MWC) 2017.
According to TENAA, the LeEco Le 2S has a model number of LEX656. Its dual-SIM edition that is dubbed as Le 2S Dual is its dual-SIM version has a model number of LEX659. The LeEco Le 2S is speculated to arrive as a successor model of LeEco Le 2 from 2016.
The images that have surfaced through TENAA listing indicate that both smartphones will be coming with dual-SIM variant. The placement of the antenna lines on the top edge appears quite similar to iPhone 7.
The LeEco 2S has a 5.5-inch IPS display that produces a screen resolution of 1,920 x 1,080 pixels. The phone is driven by MediaTek Helio X25 chipset that includes a 2.3 GHz deca-core processor.
The SoC will be coupled with 4 GB of RAM. Earlier rumors had stated it would be featuring 6 GB or 8 GB of RAM. The native storage of the smartphone is 32 GB. Like its predecessor, the smartphone is unlikely to feature a microSD card slot.
The rear side of the smartphone houses a dual-camera setup that includes a pair of 13-megapixel sensors. Its front-facing snapper is of 8-megapixel. A fingerprint scanner can be seen below the rear camera housing. The smartphone will come loaded with Android 6.0 Marshmallow OS and EUI 5.8 or higher. The device will be powered by 3,900 mAh battery that fast charging capabilities.
The LeEco Le 2S Dual shares as the same specs as its single SIM variant. Both phones measure 152.4 x 75.1 x 7.5 mm and its weight is 168 grams. Both are expected to be available in color choices like Rose Gold, Gold, Silver, White, and Gray. Since the MWC 2017 is kicking off next week on Feb. 27, speculations are rife the Chinese firm may announce the Le 2S and Le 2S Dual at the upcoming tech exhibition.