LeTV Le Max Pro Might Get Ultrasonic Fingerprint Sensor and Wi-Fi 802.11 ad

LeTV released the mid-ranger Le 1s a few months ago and the phone was a success. However, it’s high time now that the company released a powerful flagship device, and we already know that LeTV is going to release one such phone soon. Called the LeTV Le Max Pro, the phone has been leaked a couple of times before and will be the successor to the LeTV Le Max.

letv le max pro

A new leak about the Le Max Pro has reached us through the Chinese microblogging site Weibo. Though we already have heard about the general specs of the phone from its AnTuTu listing, the new leak suggests that the phone will come with the latest Wi-Fi 802.11 ad technology. We must tell you that the most recent flagships get Wi-Fi 802.11 ac technology. With the new technology, supported speeds will go as high as 7GBps!

The leak also says that the LeTV Le Max Pro will flaunt the Ultrasonic Fingerprint Recognition technology by Qualcomm. If this is true, then the Le Max Pro will be one of the first few phones to get this feature. Just to give you a general idea, the ultrasonic sensor can be embedded into the display of the phone as well as in a considerable number of other materials.

The Le Max Pro should come with Snapdragon 820, quad-core CPU, 4GB RAM, 32/64/128GB onboard storage, 6.33-inch QHD screen (2560 x 1440 pixel), 21MP rear camera, and a 4MP Ultrapixel front camera. It might also feature an iris scanner. We expect the phone to be announced at the CES 2016. Any LeTV fans here?